Aremco-Bond™ 805 Epoxy for Bonding and Molding Applications

SKU: Aremco-Bond 805
Grade: ARMC-805
$112.26 to $1,591.59
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$112.26 to $1,591.59
Units: Each
Availability: Usually ships in 3 business days
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Aremco-Bond™ 805 is an aluminum-filled, two-component (resin:hardener) epoxy paste for specialty bonding, molding and potting applications to 570°F (300°C). Provides low shrinkage, high thermal conductivity and excellent mechanical strength.

Aremco-Bond 805 should be mixed thoroghly in 100:12 ratio (by weight) to a uniform consistency. Requires curing for 2 hours at 100°F and then for 2 more hours at 200°F (recommended) or for 24 hours at room temperature plus 2 hours at 200°F. In most cases, the epoxy should be applied to both surfaces maintaining a glue line of less than 10 mils.

On the picture Aremco-Bond 805 bonds aluminum heat sink to a power semiconductor device.